Acta mater. 58(16), 5520-5531, 2010
M.J. Cordill1, F.D. Fischer2,
F.G. Rammerstorfer3, G. Dehm1
Erich Schmid Institute of Materials Science,
2 Institute of Mechanics,
Montanuniversität Leoben, Leoben, Austria
3 Institute of Lightweight Design and Structural Biomechanics,
TU Wien, Vienna, Austria
For the realization of flexible electronic devices, the metal–polymer
interfaces upon which they are based need to be optimized.
These interfaces are prone to fracture in such systems and hence form a weak
In order to quantify the interfacial adhesion, novel mechanical tests and
modeling approaches are required.
In this study, a tensile testing approach that induces buckling of films by
lateral contraction of the substrate is employed to cause delamination of the
Based on a newly developed energy balance model, the adhesion energy of Cr
films on polyimide substrates is determined by measuring the buckle geometry
induced by the tensile test.
The obtained minimum values for the adhesion energy (about 4.5 Jm-2)
of 50-190 nm thick films compare well to those found in the literature for
metal films on polymer substrates.